2.0” TFT EPD Panel % RePaper.org % 2013

1 2.0” TFT EPD Panel Product Specifications

Description 2.0” TFT EPD Panel
Model Name EG020AS012
Doc. No. 1P001-00
Revision 03

2 General Description

2.1 Overview

This is a 2.0” a-Si, active matrix TFT, Electronic Paper Display (EPD) panel. The panel has such high resolution (111 dpi) that it is able to easily display fine patterns. Due to its bi-stable nature, the EPD panel requires very little power to update and needs no power to maintain an image.

2.2 Features

  • a-Si TFT active matrix Electronic Paper Display(EPD)
  • Resolution: 200 x 96
  • Ultra low power consumption
  • Super Wide Viewing Angle - near 180°
  • Extra thin & light
  • SPI interface
  • RoHS compliant

2.3 Applications

  • Electronic shelf label (ESL)
  • Reusable container
  • Badge

2.4 General Specifications

Item Specification Unit Notes
Outline Dimension 57.0(H) x 28.8(V) x 1.0(T) mm not including the FPC
Active Area 45.800(H) x 21.984(V) mm 
Driver Element a-Si TFT active matrix
FPL V110
Pixel Number 200 x 96 pixels
Pixel Pitch 0.229 x 0.229 (111dpi) mm
Pixel Arrangement Vertical stripe
Display Colors Black/White
Surface Treatment Anti-Glare

2.5 Mechanical Specifications

Item Min. Typ. Max Unit Notes
Glass Horizontal(H) 56.7 57.0 57.3 mm
Glass Vertical(V) 28.5 28.8 29.1 mm
Glass Thickness(T) 0.8 1.0 1.2 mm not including the masking film
Weight 3.7 4.5 g

2.5.1 FPC Specification

Item Pin numbers Pitch (mm) Connector
Golden Finger 40 0.5 STARCONN 089H40 or Compatible
EPD Drawing
EPD Drawing


3 Absolute Maximum Ratings

3.1 Absolute Ratings of Environment

Item Symbol Min. Max. Unit Note
Storage Temperature TST -20 +60 ºC (1)
Operating Ambient Temperature TOP 0 +50 ºC (1), (2)

Note (1):

  • 90 %RH Max. (Ta ≦ 40 ºC), where Ta is ambient temperature.
  • Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).
  • No condensation.

Note (2):

The temperature of panel display surface area should be 0 ºC Min. and 50 ºC Max. Refresh time depends on operation temperature.

Operating Range of Relative Humidity and Temperature
Operating Range of Relative Humidity and Temperature

3.2 Reliability Test Item

Item Test Condition Remark
High Temperature Operation 50 ºC for 240h (1) (2)
High Temperature Storage 60 ºC for 240h (1) (2)
Low Temperature Operation 0 ºC for 240h (1) (2)
Low Temperature Storage -20 ºC for 240h (1) (2)
High Temperature/Humidity Operation 40 ºC / 90 %RH for 168h (1) (2)
High Temperature/Humidity Storage 50 ºC / 80 %RH for 168h (1) (2)
Thermal Cycles (Non-operation) 1 Cycle:-20ºC/30min → 60ºC/30min, for 100 Cycles (1) (2)
Package Drop Test Drop from 97cm. (ISTA) 1 corner, 3 edges, 6 sides. One drop for each. (1) (2)
Package Random Vibration Test 1.15Grms, 1Hz ~ 200Hz. (ISTA) (1) (2)

Note (1): End of test, function, mechanical, and optical shall be satisfied.

Note (2): The test result and judgment are based on PDI’s 1bit driving waveform, driving fixture and driving system.


4 Electrical Characteristics

4.1 Absolute Maximum Ratings of Panel

Parameter Symbol Min Max. Unit. Note
Digital Power VDD -0.3 5.0 V
Analog Power VCC -0.3 5.0 V
Ground VSS - - - Connect VSS to Ground

Ta = 25 ± 2 ºC  

5 Application Circuit Block Diagram

Application Circuit Block Diagram
Application Circuit Block Diagram


6 Terminal Pin Assignment & Reference Circuit

6.1 Terminal Pin Assignment

No. Signal Type Connected to Function
1 /CS I MCU Chip Select. Low enable
2 BUSY O MCU When BUSY = High, EPD stays in busy state that EPD ignores any input data from SPI.
3 ID I Ground Set SPI interface.
4 SCLK I MCU Clock for SPI
5 SI I MCU Serial input from host MCU to EPD
6 SO O MCU Serial output from EPD to host MCU
7 /RESET I MCU Reset signal. Low enable
8 ADC_IN - - Not connected
9 VCL C Capacitor
10 C42P C Charge-Pump Capacitor
11 C42M C
12 C41P C Charge-Pump Capacitor
13 C41M C
14 C31M C Charge-Pump Capacitor
15 C31P C
16 C21M C Charge-Pump Capacitor
17 C21P C
18 C16M C Charge-Pump Capacitor
19 C16P C
20 C15M C Charge-Pump Capacitor
21 C15P C
22 C14M C Charge-Pump Capacitor
23 C14P C
24 C13M C Charge-Pump Capacitor
25 C13P C
26 C12M C Charge-Pump Capacitor
27 C12P C
28 C11M C Charge-Pump Capacitor
29 C11P C
30 VCOM_DRIVER RC Resistor & Capacitor The signal duty cycle can drive VCOM voltage from source driver IC.
31 VCC P VCC Power supply for analog part of source driver.
32 VDD P VDD Power supply for digital part of source driver.
33 VSS P Ground
34 VGH C Capacitor
35 VGL C Capacitor
36 VDH C Capacitor
37 VDL C Capacitor
38 BORDER I - Connect to VDL via control circuit for white frame border
40 VCOM_PANEL C Capacitor VCOM to panel


Type: I:    Input

           O:   Output

           C:    Capacitor

           RC:  Resistor and Capacitor

           P:    Power


6.2 Reference Circuit

EPD Reference Circuit
EPD Reference Circuit

  Note: (1) VDD and VCC must be discharged promptly after power off.


7 Optical Characteristics

7.1 Test Conditions

Item Symbol Value Unit
Ambient Temperature Ta 25±2 ºC
Ambient Humidity Ha 50±10 %RH
Supply Voltage V~CC ~& VDD 3.0 V

7.2 Optical Specifications

Item Symbol Rating Unit Note
Min. Typ. Max.
Contrast ratio CR 5:1 7:1 - - θx=θy=0 (1),(2),(3),(4)
Refresh time Tr - 2 - sec (3)
White Chromaticity Wx - 0.313 - - θx=θy=0 (1),(4)
Wy - 0.338 -
Reflectance R% 25 32 - % (1),(4)

Note (1): Panel is driven by PDI waveform without masking film and optical measurement by CM-700D with D65 light source and SCE mode.

Optical measurement   

Note (2): Definition of Viewing Angle (qx, qy):

Definition of Viewing Angle to Measure Contrast Ratio
Definition of Viewing Angle to Measure Contrast Ratio

Note (3): Refresh time is the time that e-paper particles move not including the power on and off time. The refresh time is measured at 25ºC.The refresh time and contrast ratio varies due to different films, display performance requirements, and ambient temperatures.

Note (4): Contrast ratio (C.R.):  The Contrast ratio is calculated by the following expression.  C.R. =(R% White) / (R% Black).  Reflectance is measured at 120 seconds after refresh.

  # include ghosting

8 Precautions

  1. The EPD Panel / Module is manufactured from fragile materials such as glass and plastic, and may be broken or cracked if dropped. Please handle with care. Do not apply force such as bending or twisting to the EPD panel during assembly.

  2. It is recommended to assemble or install EPD panels in a clean working area. Dust and oil may cause electrical shorts or degrade the protection sheet film.

  3. Do not apply pressure to the EPD panel in order to prevent damaging it.

  4. Do not connect or disconnect the interface connector while the EPD panel is in operation.

  5. Please support the bezel with your finger while connecting the interface cable such as the FPC.

  6. Do not stack the EPD panels / Modules.

  7. Do not press the FPC on the glass edge or Pull FPC up / down to 90°.

  8. Do not touch the FPC lead connector.

  9. Wear a Wrist Strap (Grounding connect) when handling and during assembly. Semiconductor devices are included in the EPD Panel / Module and they should be handled with care to prevent any electrostatic discharge (ESD). (An Ion Fan may be needed in assembly operation to reduce ESD risk.)

  10. Keep the EPD Panel / Module in the specified environment and original packing boxes when storage in order to avoid scratching.

  11. Do not disassemble or reassemble the EPD panel.

  12. Use a soft dry cloth without chemicals for cleaning. The surface of the protection sheet film is very soft and easily scratched.

  13. Be mindful of moisture to avoid its penetration into the EPD panel, which may cause damage during operation.

  14. High temperature, high humidity, sunlight or fluorescent light may degrade the EPD panel’s performance. Please do not expose the unprotected EPD panel to high temperature, high humidity, sunlight, or fluorescent for long periods of time. It is highly recommended to store the EPD panel in a dark place without condensation, a temperature range of 15ºC to 35ºC, and humidity from 30%RH to 60%RH.

  15. The ink used for marking the Panel ID number is erased easily by solvent. Please avoid using solvent to clean the EPD panel.

  16. The EPD is vacuum packed.

  17. Before approved by PDI and customer, products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.

  18. PDI makes every attempt to ensure that its products are of high quality and reliability. However, contact PDI sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.

  19. Design your application so that the product is used within the ranges guaranteed by PDI particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. PDI bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail safes, so that the equipment incorporating PDI product does not cause bodily injury, fire or other consequential damage due to operation of the PDI product.

  20. This product is not designed to be radiation resistant.

9 Definition of Labels

Model Labels
Model Labels
Definition of Model Labels
Definition of Model Labels
Carton Label
Carton Label
Pallet Label
Pallet Label

10 Glossary of Acronyms


Electrophoretic Display (e-Paper Display)

EPD Panel


EPD Module

EPD with TCon board


Timing Controller


Thin Film Transistor


Microcontroller Unit


Flexible Printed Circuit


Front Plane Laminate


Serial Peripheral Interface


Chip on Glass


Print Contrast Signal


Pervasive Displays Incorporated